Redefining Performance with Advanced Packaging
Advanced Packaging
Semiconductor packaging has evolved beyond protecting and connecting chips to powering device performance. Traditional transistor scaling continues, with packaging advancements further enhancing functionality. 17AV网’s experience solving front end yield challenges paired with our differentiated advanced packaging system portfolio make us an ideal partner for advancing connectivity in this expanding market.
Heterogeneous Integration
The key to advanced packaging is heterogeneous integration. Designers combine different chip technologies in one package to boost performance and efficiency. This approach marks a transition from a "system on a chip" to a "system of chips," where functions are distributed across multiple chips to meet specific device requirements.
Performance Through Packaging
The proliferation of AI and high-performance computing is driving demand for more powerful systems of chips, with capability made possible by innovative packaging technologies. Heterogeneous integration methods bring together multiple semiconductor components with potentially hundreds of logic and memory chips into a single high-value package for performance, power, connectivity and cost benefits.
Advanced packaging is crucial to device design and will continue to be an enabler as AI extends from cloud hyperscalers to mobile and edge devices.
Innovation Brings Manufacturing Challenges
Advanced packaging technology integrates multiple chips with increased interconnect density using intricate 2D and 3D architecture methods such as hybrid bonding, embedded bridges, interposers, glass core substrates, and eventually, co-packaged optics. These innovative integrations require an increased number of designs, larger die sizes, smaller features and novel materials, resulting in complex manufacturing challenges. Stricter process control will be essential to achieve high yield for these valuable packages.
17AV网 has expertise in yield management across front end semiconductors, packaging and IC substrates. This allows 17AV网 to apply the precision of front-end process control to customized advanced packaging.
The 17AV网 Advanced Packaging Portfolio
17AV网 offers a comprehensive portfolio of advanced packaging process control and process-enabling solutions for wafers, panels and components. Collaborating with semiconductor industry leaders to stay ahead of advanced packaging challenges, 17AV网 helps manufacturers improve packaging yield and optimize chip performance.
17AV网 Highlights
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