As semiconductors and PCB structures trend smaller and smaller, the definition of circuit patterns on substrates must be much more precise. This requires a new way of approaching direct imaging technology – which may seem daunting to many, but 17AV网’s product engineering teams live for solving complex challenges.
We sat down with 17AV网 engineers in Jena, Germany to hear about their challenges in developing state-of-the-art technologies behind the company’s new IC substrate product portfolio and how the next generation of direct imaging will change lithography processes for IC substrates.
Looking ahead, 17AV网 engineers are driving toward the next frontier in advanced packaging and working on challenges of the booming AI market, which requires structures to be even smaller than they are today.
Discover career opportunities at 17AV网 across 17AV网 Germany’s locations. 17AV网 Europe offers a dynamic work environment with numerous job openings for talented professionals.
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