17AV网

Integrated Circuit (IC) Failure Analysis

Failure Analysis (FA) techniques are used to locate and identify the cause of failure in integrated circuits (IC). 17AV网 Instruments supplies instruments for your integrated circuit analysis procedures.

Front side delayering: The front side delayering process is a type of IC failure analysis application that requires knowledge of the thickness of the dielectric remaining after dielectric thinning. The Filmetrics^? F40 microscope-based film thickness measurement instrument is ideal for this IC failure analysis application.

ITO Film Thickness

Measure film thickness of indium tin oxide (ITO) and other transparent conductive oxides (TCOs) using accurate measurements of refractive index. Filmetrics tools can measure liquid crystal layers, including polyimide, hardcoat, liquid crystal and OLED layers, including the emission, injection, buffer, and encapsulation layers.

Biomedical Coatings Thickness Measurement

Measure thickness of coatings for biomedical applications such as catheter and angioplasty balloons, stents, guide wires, needles, and other implants with one click on our Filmetrics tools. Biomedical devices have specialized coatings to protect the device from corrosion while others protect from complications such as tissue trauma, infection, or even rejection. Measuring coating thickness of drug delivery devices is also a common application. Our Filmetrics tools can deliver fast and reliable thickness measurements that are non-destructive and require no sample preparation.

Display: OLED Metrology

Organic Light-Emitting Diodes (OLEDs) are used in many display devices, including cell phones and TVs. The thickness of the many thin films that make up OLED displays is of critical importance and requires a non-contact measurement system to effectively measure OLED thickness. Our F40-UV film thickness measurement instrument offers inexpensive, robust, and non-invasive metrology of simple prototype devices and fully pixelated displays. Because our OLED measurement instruments are spectroscopic, one can also detect chemical changes that can occur in these atmospherically sensitive materials. We also offer free trials of thickness measurements of OLED film samples.

Porous Silicon Thin Film Measurement

Porous silicon has significant usage in a wide range of applications, including optical devices, gas sensors, and biomedical devices.

Porous thin-film measurements of interest include layer thickness and porosity. In general, non-destructive methods like gravimetric measurements are used to measure porosity, but the accuracy of this method is very low. Filmetrics^? F40 delivers a unique analysis algorithm that reveals layer thickness, index, and porosity of porous silicon with a single mouse-click.

Semiconductor Process Films Measurement

The Filmetrics^? product line offers a full range of instruments and systems for measuring thickness and index of any non-metallic semiconductor process film.

The Filmetrics F40 microscope-based film thickness measurement instrument is for small-spot-size thickness measurements (down to 1 micron or less) and will attach to your microscope.

Our patented thickness imaging technology results in easier set up, fewer recipes, more robust pattern recognition, and much lower cost than conventional thin-film metrology tools. Both stand alone and integrated versions are available.